Relief Electro-Etching for Champleve Enamel - Part 2
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- Parent Category: Technical Articles from Journal Back Copies
- Category: Technical Articles 2008
Raymond Jackson
Samples for Electro-Etching
Although there are many ways of creating a design on copper for it to be etched, to investigate the basic electro process I used a peel-off stencil applied to a circular piece of copper, 45mm diameter and 0.9mm thick.
Since the stencil is adhesive, it is clearly an attraction to stick it directly on the copper surface and to allow etching to take place in the exposed areas. However, even if it is warmed and burnished to promote maximum adhesion, I found that the electrolyte leached to some extent at the stencil edges and those parts of the copper were partly etched and made narrower as a consequence. So a protective resist needs to be applied to the copper first and this is now described. Further protection is needed at the outer edge and on the reverse of the copper.
The stencil and copper sample are shown in Figure 6.
